Staera Semiconductor has emerged from stealth mode with an optical data link technology called Lightwire that combines silicon CMOS circuits, GaN LED light sources and SiN waveguides into one chip.

Nexperia has announced new ultra-low-ohmic GaN FETs, expanding its low- and medium-voltage GaN portfolio with devices spanning 18 V to 200 V.

Onsemi has introduced EliteSiC M4, its fourth-generation SiC platform built on a trench architecture and designed to set a new performance benchmark for next-generation power systems.

As part of a project commissioned by Japan’s Ministry of the Environment, Mitsubishi Electric has explained the frequency dispersion caused by crystal defects in a high-frequency GaN transistor made ...

The team has developed an ultra-wide bandgap (UWBG) semiconductor Ga 2 O 3 power module capable of handling megawatt-level power conversion, opening new possibilities for compact and highly efficient ...

Infineon Technologies has successfully processed 300-mm SiC wafers into functional power devices at its fab in Villach, Austria. It claims to be the first company to pioneer this innovation milestone ...

Eulitha AG, a Swiss provider of high-throughput optical lithography tools, has announced deliveries of multiple automated tools to foundries for the production of InP DFB lasers to be used in AI data ...

US sensor company MicroVision has announced a multi-year partnership agreement with Lake Fusion Technologies (LFT), a German developer of situational awareness systems.

Fremont-based Penguin Solutions, which describes itself as an 'AI Factory Platform company', has agreed to sell its Cree LED business to private equity firm Transom Capital Group in an all-cash ...

Its portfolio spans 40V–250V low-mid voltage and 650V–1200V high voltage GaN power devices, serving applications including AI data centres, Backup Battery Units (BBUs), robotics, drones, electric ...

HEROIC brings together SMART Photonics, Eindhoven University of Technology, Formerica OE and Hon Hai Research Institute to develop a 3.2 Tbps optical transceiver for AI data centres, targeting 400 ...

MacDermid Alpha Electronics Solutions will exhibit at electronica 2026 (November 10–13, Munich, Germany), showing its upcoming BondPad technology, an Argomax film-laminated copper-foil solution for ...