Infineon Technologies AG has successfully processed 300mm silicon carbide wafers into functional power devices at its fab in Villach, Austria.

At SEMICON Europa 2026, the Fraunhofer Institute for Photonic Microsystems IPMS will showcase current research results and technological developments for the semiconductor industry.

Mixx Technologies, Inc. today set out its view of high-density optical scale-up as a member of the Expanded Beam Optics Multi-Source Agreement (EBO MSA) and a contributing member of the Open CPX MSA.

HTEC research finds semiconductor companies are ahead in scaling AI, yet fragmented measurement is making it harder to connect engineering gains to business outcomes.

Breakthrough culminates 25 years of scientific pursuit and establishes a new scale for single-crystal diamond.

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The SEMI Silicon Manufacturers Group (SMG) reported today, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.4% year-on-year to 3,756 million ...

The Global Semiconductor Alliance (GSA) is pleased to announce its 2026 award nominees. The prestigious awards will be presented at the GSA Awards Celebration on Thursday, Dec. 10, 2026. This year’s ...

Excellence in Achievement Award honors the company's leadership in expanding apprenticeships, investing in employee advancement, and strengthening the semiconductor workforce.

According to Yole Group’s Status of the Back-End Equipment Industry 2026 report, equipment revenue will grow from $8.1 ...

ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the shipment of its first 310 × 310 mm Ultra ECP ap-p panel-level ...