Nordson Electronics Solutions accepted the 2026 Global Technology Award in the Plasma Systems category for their new, MARCH ExoSPHERE plasma treatment system.

Belgian semiconductor company ICsense reported a record year, with revenue rising 30% and profits increasing by more than 50%, driven in part by growing demand for custom chips used in brain-computer ...

Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington state.

Finetech, a supplier of high-precision die bonding systems for advanced packaging and heterogeneous integration, is expanding its management team: André Thiemann became Co-CEO on November 1.

As advanced packaging plays an increasingly important role in the performance and miniaturization of electronic components, manufacturers face growing challenges in terms of yield, precision, and ...

With Subfab NetZero, DAS Environmental Experts introduces a holistic approach to reducing emissions and operating costs. The new ALCEA waste gas abatement system for NOx treatment expands the ...

Mixx Technologies, Inc. today set out its view of high-density optical scale-up as a member of the Expanded Beam Optics Multi-Source Agreement (EBO MSA) and a contributing member of the Open CPX MSA.

Infineon Technologies AG has successfully processed 300mm silicon carbide wafers into functional power devices at its fab in Villach, Austria.

HTEC research finds semiconductor companies are ahead in scaling AI, yet fragmented measurement is making it harder to connect engineering gains to business outcomes.

At SEMICON Europa 2026, the Fraunhofer Institute for Photonic Microsystems IPMS will showcase current research results and technological developments for the semiconductor industry.

Breakthrough culminates 25 years of scientific pursuit and establishes a new scale for single-crystal diamond.

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