Electronic Design

Dual-Cool Package Technology Enables Power Dissipation Through Top of Package

To meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor developed the Dual Cool(tm) packaging for MOSFETs. The Dual Cool package is a top-side ...
Electronic Design

Dual Cool Package Improves Power Density and Performance in DC-DC Power Applications

Fairchild Semiconductor's mid-voltage PowerTrench® MOSFETs with Dual Cool™ packaging technology are well suited to aid DC-DC converter design challenges of improving power density while saving board ...
EDN

Discrete wire cable system offers high power performance in small package

Samtec's latest high performance power interconnect is a discrete wire cable system intended for space-limited applications. The PowerStrip/15 Cable Assembly (MPSS Series) is available with 2,3,4,6 or ...